Scalability of OPC-UA Down to the Chip Level Enables "Internet of Things"
J. Imtiaz, J. Jasperneite, in: 11th International IEEE Conference on Industrial Informatics 2013, Bochum, Germany, 2013.
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Konferenz - Beitrag
| Englisch
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Imtiaz, Jahanzaib;
Jasperneite, JürgenELSA
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11th International IEEE Conference on Industrial Informatics 2013
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Imtiaz J, Jasperneite J. Scalability of OPC-UA Down to the Chip Level Enables “Internet of Things.” In: 11th International IEEE Conference on Industrial Informatics 2013. Bochum, Germany; 2013.
Imtiaz, J., & Jasperneite, J. (2013). Scalability of OPC-UA Down to the Chip Level Enables “Internet of Things.” In 11th International IEEE Conference on Industrial Informatics 2013. Bochum, Germany.
Imtiaz J and Jasperneite J (2013) Scalability of OPC-UA Down to the Chip Level Enables ‘Internet of Things’. 11th International IEEE Conference on Industrial Informatics 2013. Bochum, Germany.
Imtiaz, Jahanzaib, and Jürgen Jasperneite. “Scalability of OPC-UA Down to the Chip Level Enables ‘Internet of Things.’” In 11th International IEEE Conference on Industrial Informatics 2013. Bochum, Germany, 2013.
Imtiaz, Jahanzaib und Jürgen Jasperneite. 2013. Scalability of OPC-UA Down to the Chip Level Enables „Internet of Things“. In: 11th International IEEE Conference on Industrial Informatics 2013. Bochum, Germany.
Imtiaz, Jahanzaib ; Jasperneite, Jürgen: Scalability of OPC-UA Down to the Chip Level Enables „Internet of Things“. In: 11th International IEEE Conference on Industrial Informatics 2013. Bochum, Germany, 2013
J. Imtiaz, J. Jasperneite, Scalability of OPC-UA Down to the Chip Level Enables “Internet of Things,” in: 11th International IEEE Conference on Industrial Informatics 2013, Bochum, Germany, 2013.
J. Imtiaz and J. Jasperneite, “Scalability of OPC-UA Down to the Chip Level Enables ‘Internet of Things,’” in 11th International IEEE Conference on Industrial Informatics 2013, 2013.
Imtiaz, Jahanzaib, and Jürgen Jasperneite. “Scalability of OPC-UA Down to the Chip Level Enables ‘Internet of Things.’” 11th International IEEE Conference on Industrial Informatics 2013, 2013.
Imtiaz, Jahanzaib/Jasperneite, Jürgen (2013): Scalability of OPC-UA Down to the Chip Level Enables „Internet of Things“, in: 11th International IEEE Conference on Industrial Informatics 2013, Bochum, Germany.
Imtiaz J, Jasperneite J. Scalability of OPC-UA Down to the Chip Level Enables “Internet of Things.” In: 11th International IEEE Conference on Industrial Informatics 2013. Bochum, Germany; 2013.
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