Nanoscale Particles Modified Gold Plating for Electrical Contacts
J. Song, C. Koch, L. Wang, in: International Conference on Electrical Contacts (Ed.), ICEC 2012 : 26th International Conference on Electrical Contacts, IET, Stevenage, England, 2012, pp. 331–337.
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Konferenz - Beitrag
| Veröffentlicht
| Englisch
Autor*in
Körperschaftlicher Herausgeber
International Conference on Electrical Contacts
Einrichtung
Erscheinungsjahr
Titel des Konferenzbandes
ICEC 2012 : 26th International Conference on Electrical Contacts
Seite
331 - 337
Konferenz
26th International Conference on Electrical Contacts (ICEC 2012)
Konferenzort
Beijing, China
Konferenzdatum
2012-05-14 – 2012-05-17
ISBN
ELSA-ID
Zitieren
Song J, Koch C, Wang L. Nanoscale Particles Modified Gold Plating for Electrical Contacts. In: International Conference on Electrical Contacts, ed. ICEC 2012 : 26th International Conference on Electrical Contacts. Stevenage, England: IET; 2012:331-337.
Song, J., Koch, C., & Wang, L. (2012). Nanoscale Particles Modified Gold Plating for Electrical Contacts. In International Conference on Electrical Contacts (Ed.), ICEC 2012 : 26th International Conference on Electrical Contacts (pp. 331–337). Stevenage, England: IET.
Song J, Koch C and Wang L (2012) Nanoscale Particles Modified Gold Plating for Electrical Contacts. In International Conference on Electrical Contacts (ed.), ICEC 2012 : 26th International Conference on Electrical Contacts. Stevenage, England: IET, pp. 331–337.
Song, Jian, Christian Koch, and Liangliang Wang. “Nanoscale Particles Modified Gold Plating for Electrical Contacts.” In ICEC 2012 : 26th International Conference on Electrical Contacts, edited by International Conference on Electrical Contacts, 331–37. Stevenage, England: IET, 2012.
Song, Jian, Christian Koch und Liangliang Wang. 2012. Nanoscale Particles Modified Gold Plating for Electrical Contacts. In: ICEC 2012 : 26th International Conference on Electrical Contacts, hg. von International Conference on Electrical Contacts, 331–337. Stevenage, England: IET.
Song, Jian ; Koch, Christian ; Wang, Liangliang: Nanoscale Particles Modified Gold Plating for Electrical Contacts. In: International Conference on Electrical Contacts (Hrsg.): ICEC 2012 : 26th International Conference on Electrical Contacts. Stevenage, England : IET, 2012, S. 331–337
J. Song, C. Koch, L. Wang, Nanoscale Particles Modified Gold Plating for Electrical Contacts, in: International Conference on Electrical Contacts (Ed.), ICEC 2012 : 26th International Conference on Electrical Contacts, IET, Stevenage, England, 2012: pp. 331–337.
J. Song, C. Koch, and L. Wang, “Nanoscale Particles Modified Gold Plating for Electrical Contacts,” in ICEC 2012 : 26th International Conference on Electrical Contacts, Beijing, China , 2012, pp. 331–337.
Song, Jian, et al. “Nanoscale Particles Modified Gold Plating for Electrical Contacts.” ICEC 2012 : 26th International Conference on Electrical Contacts, edited by International Conference on Electrical Contacts, IET, 2012, pp. 331–37.
Song, Jian et. al. (2012): Nanoscale Particles Modified Gold Plating for Electrical Contacts, in: International Conference on Electrical Contacts (Hg.): ICEC 2012 : 26th International Conference on Electrical Contacts, Stevenage, England, S. 331–337.
Song J, Koch C, Wang L. Nanoscale Particles Modified Gold Plating for Electrical Contacts. In: International Conference on Electrical Contacts, editor. ICEC 2012 : 26th International Conference on Electrical Contacts. Stevenage, England: IET; 2012. p. 331–7.
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